| Technical Specifications |
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Printed Circuit Board
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Dimensions
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PC•MIP module type II (single-size 47x99.25mm), height 10mm (10H envelope)
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ISDN Port
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Interface Type
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ISDN basic rate TA S/T (2B+D), B channel data transfer rate 2x64kbps (56kbps restricted
mode for US ISDN lines selectable), protocol D channel transfer rate 16kbps
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Controller Chip
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HFC-S PCI A single-chip PCI ISDN S/T transceiver, independent read and write HDLC
channels for two ISDN B channels and one ISDN D channel, independently selectable B1 and
B2 channel transparent mode, FIFO memory window 4x7.5kByte (B cannel) and 2x512Byte
(D channel), maximum 31 HDLC frames (B channel) and 15 HDLC frames (D channel) per
channel and direction in FIFO, I2C serial EEPROM interface for configuration data storage
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Physical Interface
Connector J4
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S/T interface, RJ45 ISDN standard connector, front panel mounted, complies with ITU-T
I.430 specification, dual transformator / choke module, isolation voltage 1500Vrms
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LED Array
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2 x on-board LED, power (green), ISDN link (yellow)
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PCI Bus (PC•MIP)
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Connector
J1/J2
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32bit, 33MHz, DMA Bus Master, 133MBps
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Power Consumption
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Connector
J1/J2
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+5V ±5% 0.1A max.
+3.3V ±0.3V 0.1A max.
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Temperature
Humidity
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Commercial Grade Version
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Operating temperature 0-70°C
Relative humidity 5-90% non condensing
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